BM-Slim3

Ultra-slim FAP30 Standalone Single Fingerprint Scanner Module

Ultra-slim Size at
Only 15mm Height

BM-Slim3 is a FBI PIV and Mobile ID FAP30 Certified* fingerprint module that provides a number of industry-leading features under its sleek design. Featuring range-leading powerful 1.0Ghz CPU, BM-Slim3 provides high-speed extraction and matching of fingerprints on device. BM-Slim3 also supports true plug-n-play by featuring HID(human interface device) protocol and Xperix’s proprietary Multi-dynamic Range(MDR) technology. BM-Slim3 provides Live Finger Detection(LFD) technology by applying a machine learning method based AI(Artificial Intelligence).

Device Height
15 mm

33% Larger Platen

Compared to BM-Slim2
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BM-Slim3 (21.5 mm x 26.5 mm​)
+33%
FAP30​​ standard (20.32 mm x 25.4 mm)
BM-Slim2 (16.5 mm x 21 mm​)
Platen Size (WxL)

FBI PIV & Mobile ID FAP 30 Certified

The Scanner features large platen​​ that spans 21.5mm x 26.5mm wide, which is well above the FAP30​​ standard that spans 20.32mm x 25.4mm.

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Capable up to

100,000 LUX

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Operates under direct sunlight

Xperix’s patented MDR technology guarantees exceptional fingerprint​​ image quality even under extreme direct light condition up to 100,000 LUX.​​ While providing faster image capture speed of up to 6 ms, MDR technology​​ allows superior sensing capability regardless dryness as well as​ light conditions.

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Capture High-quality fingerprint image even on dry & wet finger

Enhanced Security

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BM-Slim3 has been designed to provide highest level of security available by featuring on-device encryption of fingerprint templates as well as supporting security protocols including WiFi WPA2 and HTTPS.

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Rugged IP65 rated
Dust & Waterproof sensor surface

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BM-Slim3 adopts new improved optical sensor which also provides exceptional durability. The rugged sensor housing effectively protects sensitive optical structure from dust, moisture and liquid.

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AI-based Liveness Detection

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BM-Slim3 provides advanced artificial Intelligence-based Live​ Finger Detection technology that distinguishes fake fingerprints​ made from various materials including clay, rubber, silicon, glue,​ paper, film and more.

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Standalone operation

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Featuring range-leading powerful 1.0GHz CPU, BM-Slim3 allows standalone​ operation with on-device high speed fingerprint extraction and matching.

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Optimized for easy integration

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Experience seamless integration with BM-Slim3, empowered by the comprehensive BioMini SDK. Maximize efficiency with our advanced multi-threaded code design, perfectly optimized for multi-core CPU utilization.

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True Plug-n-Play

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It features a user-friendly interface and LED indicator, optimized for seamless integration into both mobile and desktop devices.

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Windows, Linux,
and Android Support

On-Device Encryption
Ultra Slim Sensor Module
15mm
Windows Hello Compliance
LFD Technology
Highspeed Capture
​Android
Windows
Linux
FAP30​ Certified
USB Host
IP65, Water & Dust Resistant
SDK Support
Certified
Interoperable Image

Discover our solutions

Specifications

  • Sensor & Image
    • Capture

      Flat(Single) fingers

    • Sensor Type​

      Optical

    • Resolution

      500 ppi

    • Grayscale

      8-bit, 256 levels

    • Image Size (WxL)

      400 x 500 pixels​

    • Template Format​

      Xperix, ISO19794-2, ANSI 378

    • Supported Image Formats​

      RAW, BMP, ISO 19794-4, WSQ(FBI certified)

    • Encryption

      Device: AES-256, RSA 1024bit, ECC 521bit
      SDK: AES-256

    • FBI / Image Certifications​

      Mobile ID FAP 30 (PIV-071006), PIV Single Finger (PIV-071006), FIPS

  • System
    • OS Support​

      Windows 7 or higher 32/64bit,
      Linux Ubuntu, Debian, Fedora, OpenSUSE, CentOS 32/64bit,
      Android 5.0 or higher (USB Host),
      OS/Platform Independent, Stand-alone Operation

  • Weight & Dimensions
    • Weight

      48.6 g

    • Platen Size (WxL)​

      21.5 mm x 26. 5mm

    • Sensing Area (WxL)

      20.32 mm x 25.4 mm

    • Dimensions (WxLxH)​

      67.5 mm x 36 mm x 15 mm

  • Durability
    • Suface Protection

      Optic Glass (Scratch free)

    • Ingress Protection

      IP65 (Sealed between bezel and sensor surface)

    • Operating Temperature​

      -10 °C - 50 °C (14 ℉ - 122 ℉)

    • Operating Humidity​

      0% - 90%, non-condensing

  • Power & Connectors
    • Interface​

      USB 2.0 High Speed​

    • Power Source​

      USB Host​

    • USB Voltage Level

      5.0V ±10%​

  • General
    • Live Finger Detection(LFD)​

      Supported (by AI-based)

    • Plug & Play

      Supported (by HID Protocol)​

    • Stand-alone Mode​

      Supported​

    • Multi Dynamic Range(MDR)​

      Supported​

  • Certification
    • Certification

      FBI, CE, FCC, KC, RoHS, USB-IF, CB, IEC 62471, WEEE, REACH, BIS, WHQL

Resources
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Technical​ Support​